Capability OverviewCapability

ITEM

Capability

Month Capability

1000types/month,8,000sqm/month

Board Material

Standard FR4: Shengyi, ITEQ, KB, GDM High TG: S1000-2, IT180 

HIGH Frequency: Rogers, Arlon, Nelco, Taconic, Teflon

Surface treatment

OSP, HASL, LF-HASL, ENIG(Chem. Gold), Immersion Tin,

 Immersion silver, 
Plating hard gold, Gold fingers,Flash gold, ENEPIG 

Tolerance

Board thickness tolerance 1.0mm: +/-0.1mm 1.0mm-2.0mm:

 +/-10% >2.0mm: +/-8% 

Hole diameter tolerance PTH: +/-0.075mm NPTH:+/-0.05mm

Hole location tolerance: +/-0.075mm

Outline tolerance: < 100mm: +/-0.1mm 100mm-300mm:

+/-0.15mm >300mm: +/-0.2mm

Technical Specification

Layers: 1-16 layers

Min line width/space: 0.075/0.075mm

Min hole: 0.15mm (mechanical drilling) 0.1mm (laser drilling)

Min pad ring: 0.1mm

Max copper thickness: 12oz

Max board size:1-2 layers: 635 X 1100mm Multilayers: 500 X 1100mm

Board thickness: 2-layers: 0.2-7.0mm Multi-layers: 0.4-7.0mm

Inner layers: 0.1mm

Board warpage: ≤1°

Min solder mask bridge: 0.08mm

Aspect Ration: 8:1

Plugging Vias capability: 0.2-0.8mm

Au, Ni thickness control:

1. Chem gold: Au:1-10u”

2. Gold fingers: Au:1-150u”

3. Flash gold: Au:1-10u”

4. Hard gold:Au:1-150u”

5. Ni thickness:50-1000u” 6. ENEPIG: Au:1-8u”,Pd:2-5u