Capability OverviewCapability
Capability
ITEM |
Capability |
Month Capability |
1000types/month,8,000sqm/month |
Board Material |
Standard FR4: Shengyi, ITEQ, KB, GDM High TG: S1000-2, IT180 HIGH Frequency: Rogers, Arlon, Nelco, Taconic, Teflon |
Surface treatment |
OSP, HASL, LF-HASL, ENIG(Chem. Gold), Immersion Tin, Immersion silver, |
Tolerance |
Board thickness tolerance 1.0mm: +/-0.1mm 1.0mm-2.0mm: +/-10% >2.0mm: +/-8% |
Hole diameter tolerance PTH: +/-0.075mm NPTH:+/-0.05mm |
|
Hole location tolerance: +/-0.075mm |
|
Outline tolerance: < 100mm: +/-0.1mm 100mm-300mm: +/-0.15mm >300mm: +/-0.2mm |
|
Technical Specification |
Layers: 1-16 layers |
Min line width/space: 0.075/0.075mm |
|
Min hole: 0.15mm (mechanical drilling) 0.1mm (laser drilling) |
|
Min pad ring: 0.1mm |
|
Max copper thickness: 12oz |
|
Max board size:1-2 layers: 635 X 1100mm Multilayers: 500 X 1100mm |
|
Board thickness: 2-layers: 0.2-7.0mm Multi-layers: 0.4-7.0mm Inner layers: 0.1mm |
|
Board warpage: ≤1° |
|
Min solder mask bridge: 0.08mm |
|
Aspect Ration: 8:1 |
|
Plugging Vias capability: 0.2-0.8mm |
|
Au, Ni thickness control: 1. Chem gold: Au:1-10u” 2. Gold fingers: Au:1-150u” 3. Flash gold: Au:1-10u” 4. Hard gold:Au:1-150u” 5. Ni thickness:50-1000u” 6. ENEPIG: Au:1-8u”,Pd:2-5u |